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The EddyCus TF lab 4040 is dedicated to non-contact single point sheet resistance measurement of larger substrates. The flexibly applicable bench-top device allows precise manual sheet resistance measurement of conductive thin films and the thickness of metal layers. Most common applications include the measurement of thin conductive layers, doped wafers and conductive polymers.

Non-contact sheet resistance and layer thickness measurement device The EddyCus TF lab 4040 is dedicated to non-contact single point sheet resistance measurement of larger substrates. The flexibly applicable bench-top device allows precise manual sheet resistance measurement of conductive thin films and the thickness of metal layers. Most common applications include the measurement of thin conductive layers, doped wafers and conductive polymers.

Non-contact sheet resistance and layer thickness measurement device for single point measurements The EddyCus TF lab 2020 allows manual single point measurements of conductive thin films and layer thickness measurement of thin metal layers in non-contact mode. The compact bench-top device is ideal for fast and accurate measurements of samples up to 200 x 200 mm² (8 x 8 inches). In addition to the measurement of thin conductive layers also doped wafers and conductive polymers can be analyzed.

Handheld device for sheet resistance measurement The EddyCus TF portable is a handy and portable measurement device for fast contact measurement of large glasses and foils in production or in the field, for example for quick quality checks after manufacturing or as incoming good inspection. The handheld device allows the measurement even of hidden and encapsulated layers. It is an easy-to-use device that is controlled via a touch display.

Non-contact sheet resistance mapping The Eddy­Cus TF map 2525SR auto­mat­ic­ally meas­ures the sheet res­ist­ance of large samples up to 250 x 250 mm² (10 x 10 inches) in non-con­tact mode. Upon manu­al sample po­s­i­tion­ing the device auto­mat­ic­ally meas­ures and dis­plays an ac­cur­ate map­ping of the sheet res­ist­ance across the en­tire sample area. The meas­ure­ment set­tings al­low eas­ily and flex­ibly to choose between fast meas­ure­ment times of be­low 1 minute or high spa­tial meas­ure­ment res­ol­u­tion of more than 100,000 meas­ure­ment points.

Non-contact sheet resistance and layer thickness measurement solutions for process control The EddyCus TF inline series measures layer properties such as metal layer thickness or sheet resistance in non-contact on various substrates. Typical substrates are glass, foil, paper, wafer, plastic or ceramic. Measurements are obtained by permanent measurements or by trigger events to obtain equidistant results in fast moving coating processes or measure on specific positions on small specimen. Monitoring is possible in atmosphere and in vacuum. The measurements are obtained using high samples rate and can be directly provided for process control systems and customer software. Additionally SURAGUS offers the monitoring software EddyCus TF control that visualizes, stores and analyses metrology data.