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    Photoresist and Polyimide Coating System

    SPT200

    SPT200

    Ultrasonic spray of photoresist for MEMS wafers and other substrates with varying topographies
    Pricing & Availability Add to wishlist SonoTek
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    A simple, economical and repeatable process for photoresist coatings in photolithography wafer processing with fine control of flow rate, coating speed, and deposition amount using an advanced layering technique. 

    • Uniform thin film coverage of various surface profiles.
    • Capable of coating high aspect ratio trenches with excellent uniformity.
    • Non-clogging atomized spray.
    • Ability to deposit thin single micron layers with high uniformity.
    • Repeatable proven spray process.

     

    Basic Specifications

    DIMENSIONS: 1066mm W x 1765 mm H x 1095 mm D (42” W x 70” H x 43” D)
    WORK AREA: 465 mm x 465 mm x 100 mm (19.7” x 19.7” x 3.9”)
    CONTROL: Windows-based (pc included 19-inch touch screen interface)
    POWER REQUIREMENTS: 208-240VACc, 16A max, 50/60 Hz 1 phase (L,N,G) or (L1, L2, G)
    AIR: 551.6 kPa (80PSI) 1 compressed air, 1 nitrogen
    MOTORS: Brushless DC Servo
    CERTIFICATION: CE
    ULTRASONIC NOZZLE DESIGNS: Vortex, AccuMist, Impact

     

    Specification :
    Specifications Kindly refer to the "Product Overview" tab.
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