EP100-FP/EP400-FP

Electronics additive manufacturing equipment is primarily applied in industries such as display, semiconductor packaging, and lithium batteries, enabling the printing of micro/nano-scale functional structures with feature sizes down to 1-10 μm. enovate3D’s electronic additive manufacturing platform employs Direct Ink Writing (DIW) technology combined with proprietary nano-scale ink materials, achieving 3D printing of high-performance metallic conductive materials, polymers, and composite dielectric materials. This system is capable of printing ultrafine interconnects, passive components, microwave electronics, flexible circuits, and 3D circuitries. Users can achieve software-driven automated printing based on CAD data or parametric programming, ensuring high flexibility in manufacturing processes.