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TFA – Thin Film Analyzer

Physical properties measurement of thin films

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Main System Characteristics

High quality, easy to use characterization system for thin films (nm to µm range).
Temperature dependent measurements (-170°C up to +280°C).
Easy sample preparation and handling.
Chip based measurement device with pre-structered chips as consumeables.
High measurement flexibility (sample thickness, sample resistivity, deposition methods).
All measurements are taken from the same sample in one run.
It is possible to measure semiconductors as well as metals, ceramics or organics.

MODELL	TFA – THIN FILM ANALYZER*
Temperature range:	RT up to 280°C -170°C up to 280°C
Sample thickness:	From 5 nm to 25 µm (range depends on sample)
Measurement principle:	Chip based (pre-structured measurement chips, 24 pcs. per box)
Deposition techniques:	Include: PVD (sputtering, evaporation), ALD, Spin coating, Ink-Jet Printing and more
Measured parameters:	Thermal Conductivity (3 Omega) Specific Heat
Optional:	Electrical Conductivity / Resistivity Seebeck Coefficient Hall Constant / Mobility / Charge carrier conc. Electromagnet up to 1 T or permanent magnet up to 0.5 T
Vacuum:	up to 10^-5mbar
Electronics:	Integrated
Interface:	USB
Measurement range
Thermal Conductivity:	0.05 up to 200 W/m?K
Electrical Resistivity:	0.05 up to 1?10⁶ S/cm
Seebeck Coefficient:	5 up to 2500 μV/K
Repeatability
Thermal Conductivity:	± 7% (for most materials)
Electrical Resistivity:	± 3% (for most materials)
Seebeck Coefficient:	± 5% (for most materials)
Accuracy
Thermal Conductivity:	± 10% (for most materials)
Electrical Resistivity:	± 6% (for most materials)
Seebeck Coefficient:	± 7% (for most materials)