Photoresist and Polyimide Coating System

A simple, economical and repeatable process for photoresist coatings in photolithography wafer processing with fine control of flow rate, coating speed, and deposition amount using an advanced layering technique. 

• Uniform thin film coverage of various surface profiles.
• Capable of coating high aspect ratio trenches with excellent uniformity.
• Non-clogging atomized spray.
• Ability to deposit thin single micron layers with high uniformity.
• Repeatable proven spray process.

 

Basic Specifications

DIMENSIONS: 1066mm W x 1765 mm H x 1095 mm D (42” W x 70” H x 43” D)

WORK AREA: 465 mm x 465 mm x 100 mm (19.7” x 19.7” x 3.9”)

CONTROL: Windows-based (pc included 19-inch touch screen interface)

POWER REQUIREMENTS: 208-240VACc, 16A max, 50/60 Hz 1 phase (L,N,G) or (L1, L2, G)

AIR: 551.6 kPa (80PSI) 1 compressed air, 1 nitrogen

MOTORS: Brushless DC Servo

CERTIFICATION: CE

ULTRASONIC NOZZLE DESIGNS: Vortex, AccuMist, Impact