Sputter System

Specifications

• Complete package ready for coating includes; etch cathode, mechanical pump and oil, system manual
• Noble Metal Targets Available: Gold, Silver, Palladium, Gold/Palladium  and Platinum
• Single cabinet design with all assemblies in the cabinetry.
• Integral dual stage direct drive rotary vane 1.4 cfm vacuum pump.
• Manually controlled operation in plate mode.
• Manually controlled operation in etch mode.
• Manually controlled operation in plasma mode.
• Pulse mode of operation for 30% duty cycle.
• 3000 volt, 30 milliamperes power supply.
• End point by time, 1 to 14 minutes.
• End point by quartz thickness monitor option, 1 to 999 nm.
• Anode and dark space shield attract heat bearing electrons away from the sample.
• Magnet deflects electrons into anode and dark space shield.
• Target 75 mm x 50 mm annulus.
• Safety Interlock Hardware for vacuum and high voltage.
• Automatic vent at process termination.
• Adjustable stage height of up to 35 mm total movement.
• Stage diameter accommodates up to 12 SEM pin stubs.
• Stage diameter accommodates up to 75 mm diameter substrates.
• Grain size less than 2 nanometers.
• Plus/minus 10% uniformity over 75 mm diameter substrates without rotation of the sample.
• Chamber 115 mm diameter x 125 mm height.
• Chamber is annealed, ends are ground, polished and re-annealed.
• System is 559 mm x 508 mm x 356 mm. (w,d,h)
• Digital display of vacuum
• Analog display of current.
• Heat rise at the sample can be limited to 2° C.
• OPTIONAL:
• CE Marked
• 220-Volt
• Tilt / Rotate Stage
• Carbon Evaporation Accessory (CEA)
• Turbomolecular pumping
• Digital Thickness Monitor, 1 to 999nm