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NIL Technology (NILT) specializes in nanopatterning and nanoimprint lithography. NILT has experience in meeting complex demands for research and new product development activities, and assists customers in all stages from pattern design to imprinted pattern.

Nanoimprint Lithography Services

  • NILT offers UV and thermal nanoimprint lithography and hot-embossing services based on commercially available nanoimprint lithography tools.
  • Imprinting is offered on any substrate type and into any polymer material required.
  • Typical substrate types are Silicon, Fused Silica, III-V materials and polymer sheets and typical imprint polymers are PMMA, COC, COP, PC and PET.
  • If required, NILT also offers pre and post processing of the substrates.
 
Compact Nanoimprint Tool
  • The Compact Nanoimprint Tool (CNI Tool) is a desktop thermal nanoimprint lithography system, designed for easy and reliable use.
  • Ideal for small labs and research groups that are starting up NIL activities. The tool has few installation requirements and occupies zero foot print in the laboratory.
  • The CNI Tool offers a solution with unique temperature control and low imprinting pressure. The tool is used with CNI Stamps that come in different configurations to match exact requirements.
   
NLS UV Nanoimprint System
  • Nanolithosolution’s (NLS) Nanoimprint Technology Platform (NTP) is a standalone nanoimprint station, includes a nanoimprint module with AutoRelease™ function and an automatic imprint controller.
  • NTP includes a customized LED UV exposure source, and a micro-position fixture.
  • The NTP provides interfaces for customized configuration, special imaging systemand platform for external probes.
  • The solution provides a state of the art nanoimprint solution for anyone familar with the traditional photolithography process. It is scalable with many upgradable functions designed for university and research environments.
  • Simple and robust process- Proven through the use in research of world-leading institutions.
  • Alignment: Mask alignment is limited only by imaging subsystem capability.
  • Easy to use: A person familiar with semiconductor processes can be trained in a few hours.

 


   
   
   
   
   
   
   
 
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